Chengdu Dali Electronics: Analysis of Core Points in PCB Manufacturing
Time:2025-12-03
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In the electronics industry, PCB is the basic carrier of electronic circuits, providing mechanical support and electrical connections for circuits. Its applications cover various electronic devices and benefit billions of users. As a professional PCB manufacturer, Chengdu Dali Electronics has been deeply involved in the field for many years, taking you to quickly grasp the core points of PCB manufacturing.
The Technological Evolution of PCB Manufacturing
Nowadays, PCB has become the "skeleton" of electronic devices, but technology is still constantly upgrading: the wire size is constantly shrinking (from millimeter level to micrometer level), the number of layers is gradually increasing (from single layer to tens of layers), and the design rules are also optimized with the miniaturization of SMT (surface mount technology) equipment, ensuring adaptability to high-precision soldering processes and meeting the requirements of electronic devices for lightweight and high integration.
Core materials for PCB manufacturing
1. Substrate material: Select according to demand
The PCB substrate needs to be selected according to product requirements, and mainstream materials have their own characteristics:
FR4 glass fiber substrate: the most commonly used, with good temperature stability and moderate cost, suitable for most scenarios such as consumer electronics and industrial equipment, and is the basic material selection for Jiejia Zhizao PCB manufacturing;
Low cost alternative materials: such as phenolic resin substrates, used for low-priced commercial products (such as simple toys and basic household appliances);
PTFE substrate: low dielectric constant, low signal loss, suitable for high-performance RF design (such as communication base stations, radar equipment), but high processing difficulty and strict manufacturing process requirements.
2. Copper clad laminate: the "basic skeleton" of PCB
Copper clad laminate is the core substrate for PCB manufacturing, which is composed of a substrate (such as FR4, PTFE) and two copper foils on both sides. Among them, the FR4 substrate has good bonding with copper foil and low processing difficulty; The PTFE substrate has special characteristics, and the difficulty of copper foil adhesion and processing is higher, requiring professional process breakthroughs (such as the specialized processing solution developed by Jiejia Zhizao for PTFE PCB).
Key processes in PCB manufacturing
1. Mainstream process: photolithography+chemical etching
This is the core process of mass producing PCBs:
Coating photoresist on the surface of bare PCB copper foil;
Transfer the routing pattern to the photoresist by exposing it through a photosensitive mask;
After development, only the photoresist in the routing area is retained;
Using ferric chloride etching to remove copper foil without photoresist coverage requires precise control of the etching time (excessive etching can damage the photoresist and cause pattern blurring).
2. Prototype process: Suitable for small batch requirements
Precision milling machine: driven by PCB design files, automatically grinds off excess copper foil, suitable for small-scale prototype production and cannot be mass-produced;
Screen printing: Printing etching resistant ink on the surface of PCB to simplify the process, also used for small-scale prototype development.
Advantages of PCB Manufacturing by Jiejia Zhizao
As a professional PCB manufacturer, Jiejia Zhizao has three core capabilities:
Material adaptation: It can flexibly handle various substrates such as FR4 and PTFE, solving the problem of PTFE processing;
Precision technology: Mass production adopts high-precision photolithography+etching technology, and the prototype supports milling machines and screen printing solutions, balancing efficiency and flexibility;
Quality control: Full process inspection (from substrate entry to finished product delivery) to ensure PCB meets dimensional accuracy and electrical performance requirements.
The Future Direction of PCB Manufacturing
In the future, PCB manufacturing will develop towards "finer, higher level, and more environmentally friendly": the wire size will be further reduced, the number of layers will exceed 50, and environmentally friendly materials (such as lead-free substrates) and processes will become mainstream. Chengdu Dali Electronics will also continue to upgrade its technology and promote innovation in the PCB manufacturing industry.
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